Previously released X7 series of smartphones from Realme used to provide great mid-range specs and became really popular as an offering. The company is all set now to launch yet another smartphone in the X series, which might be focused more on providing a premium flagship or high-end experience. The rumors suggest that the new smartphone will be named the Realme X9 and it will come with a glass back panel with an iridescent finish, similar to Realme V15 and X7 pro smartphones. The phone is rumored to be powered using the Mediatek Dimensity 1200 processor which is a flagship chipset based on 6 nm architecture.
The phone. The details of using this chipset were also confirmed by CEO Madhav Sheth on Twitter. He also shared the alleged image of Realme X9 a few days back with the “Dare to Leap” branding. The leaks suggest that the smartphone will come with a loudspeaker grille, a USB Type-C port, and a microphone at the bottom. The only missing part in this phone seems to be the 3.5mm jack, which is not confirmed as of now.
The phone was earlier believed to be the revamped version of Realme X7 Pro, but since this model was already listed on the Indian website of Realme, it is confirmed that the X9 will be a new phone altogether. It is also rumored that the phone could be using the 108MP camera sensor and will be backed up by two 13MP sensors as well. Other leaked details hint at a 6.4-inch OLED display with a 120Hz refresh rate and 4,500 mAh battery with 65W fast charging support. The company will also be launching another smartphone this year, which is said to be their premium flagship with SD 888 chipset.